Semi automatic full laminating machine

Products > Semi automatic full laminating machine
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Semi automatic full laminating machine

This equipment is used for high-precision automatic bonding of OGS, TP and LCM that have been bonded with OCA adhesive. Alignment, vacuuming and bonding are automatically completed by the equipment.

1. The upper platform adopts silica gel to prevent screen explosion;

2. The alignment platform adopts UVW high-precision alignment platform to ensure the repeated alignment accuracy of 0.05mm;

3. The equipment yield can reach more than 98% (deviation, screen burst, bubble), except for poor materials;

4. CCD capture and alignment mode: capture the diagonal of OGS / TP window and the diagonal of liquid crystal pixel point, and automatically calculate the window center and overlap. The fitting accuracy will not be affected by the size of the window, and the window will always be centered;

5. The dual station equipment can be operated by one person, and the dual station application is more flexible. The two stations can be used independently;

6. Short beat time and high machine efficiency.